Internship – Package Optimization in Thermal Simulation (f/m/div)

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Your role

Key responsibilities in your new role

• Focus on the Future & Parametrization: Development and advancement of an automated workflow for package optimization. This includes parametric CAD modeling with Autodesk Inventor to provide agile design variants for thermal and electrical analyses.
• Take Responsibility & Simulation: Performing detailed thermal and electrothermal FEM simulations using Ansys Mechanical. You will systematically investigate the influence of design parameters on the performance, heat distribution, and reliability of the components.
• Holistic Overview & Optimization: Application of advanced optimization methods using Ansys Optislang. You will link the parametric CAD side with simulation results to conduct automated optimization studies and identify the best design trade-offs.
• Expand your Horizons: Transferring the developed "Simulation-Optimization" workflow to various package types and scaling the methods to new product lines.
• Inform Your Colleagues: Documenting the methodology and results, as well as professionally presenting optimization achievements in regular meetings and reports.

Your profile

Qualifications And Skills To Help You Succeed

• Study Field: Master's degree in a relevant field such as Mechanical Engineering, Electrical Engineering, Physics, Mechatronics, or a related engineering discipline.
• Skills (CAD & FEM): Strong skills in parametric 3D modeling with Autodesk Inventor. Solid experience in performing thermal and electrothermal analyses using Ansys Mechanical.
• Optimization & Automation: Experience or a strong interest in applying optimization algorithms with Ansys Optislang (linking CAD parameters and FEM results). Good programming and scripting skills in Python to automate simulations or support data post-processing.
• Experience: Practical experience with FEM simulations in the context of thermo-mechanical or electrothermal problems is an advantage.
• Personality: Reliability, analytical thinking, ability to work in a team, and the capacity to communicate complex technical relationships in an understandable manner.
• Language Skills: Very good German or English language skills (written and spoken).

Please attach the following documents to your application:

• CV in English
• Certificate of enrollment at university
• Excerpt of the study regulations for the mandatory internship (if applicable)
• Latest grades transcript (not older than 6 months)
• High school report

Further links:

• Find out what we are looking for in your CV
• Find out how the student application process works with us
• Discover our student website

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

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We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.

Fiona Staps