Internship / Thesis in Process Engineering, Location: Erfurt/Germany
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Internship / Thesis in Process Engineering, Location: Erfurt/Germany
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etching timesRF poweretchingpressure rangesnitride/oxide thickness measurementdatabaseslogisticsautomation technologyGerman (B2) and EnglishRIE nitride processgas quantities
Erfurt, Germany
Start your career in the semiconductor industry now. As an international microchip manufacturer from Erfurt, we offer you future-oriented topics and responsible tasks. With 45 nations on 3 continents, we rely on specialized knowledge in microchip manufacturing. Become part of our X-FABulous team!
Your Role
Would you like to complete a (mandatory) internship in a technical environment or do you need support with your thesis (Bachelor, Master)?
X-FAB's process engineering team in Erfurt/Germany will be the right place for you:
Topic 1: RIE nitride process optimization
During pore etching, holes are etched into the nitride membrane. The etching must stop on the underlying oxide. If the oxide is over-etched, it is no longer possible to process the wafer further and the wafer is scrapped.
The existing process is to be optimized in a series of tests.
The processor is to determine the remaining nitride/oxide thickness and the etching dimension with various parameter changes on some test wafers in order to evaluate his experiments.
Goal
You are an enrolled student (m/f/d) in a technical degree program with a focus on electrical engineering, automation technology, mechanical engineering, mechatronics, process engineering, technical physics or similar.
We look forward to your application!
Contact person : Ulrike Meckert
Apply now
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Start your career in the semiconductor industry now. As an international microchip manufacturer from Erfurt, we offer you future-oriented topics and responsible tasks. With 45 nations on 3 continents, we rely on specialized knowledge in microchip manufacturing. Become part of our X-FABulous team!
Your Role
Would you like to complete a (mandatory) internship in a technical environment or do you need support with your thesis (Bachelor, Master)?
X-FAB's process engineering team in Erfurt/Germany will be the right place for you:
Topic 1: RIE nitride process optimization
During pore etching, holes are etched into the nitride membrane. The etching must stop on the underlying oxide. If the oxide is over-etched, it is no longer possible to process the wafer further and the wafer is scrapped.
The existing process is to be optimized in a series of tests.
The processor is to determine the remaining nitride/oxide thickness and the etching dimension with various parameter changes on some test wafers in order to evaluate his experiments.
Goal
- Improvement of homogeneity
- More selective etching: silicon nitride to silicon dioxide
- Etching dimension (lateral) should remain the same
- Gas quantities
- RF power
- Pressure ranges
- Etching times
You are an enrolled student (m/f/d) in a technical degree program with a focus on electrical engineering, automation technology, mechanical engineering, mechatronics, process engineering, technical physics or similar.
- Basic knowledge of automation technology and logistics
- Good handling of databases
- Basic knowledge of project work desirable
- Good written and spoken German (at least B2) and English skills
- International and open environment
- Specialized expertise
- Cross-departmental cooperation
- Very good transport connections & free parking spaces
- Free drinks on site and much more.
We look forward to your application!
Contact person : Ulrike Meckert
Apply now
Back to list
